TY  - GEN
A1  - Döring, Bernd
A1  - Hechler, Oliver
T1  - Verfahren und Vorrichtung zu Temperierung von Bauteilen : Offenlegungsschrift
T1  - Device for tempering of component parts in which continuous gap exists between outer contour of pipe element and cavity contour of mineral component has arrangement whereby gap is filled completely with cellular material
Y1  - 2003
UR  - https://opus.bibliothek.fh-aachen.de/opus4/frontdoor/index/index/docId/6039
PB  - Deutsches Patent- und Markenamt
CY  - München
ER  -