@book{YoshinobuSchoening2020,
  author    = {Yoshinobu, Tatsuo and Sch{\"o}ning, Michael Josef},
  title     = {Light-addressing and chemical imaging technologies for electrochemical sensing},
  editor    = {Yoshinobu, Tatsuo and Sch{\"o}ning, Michael Josef},
  publisher = {MDPI},
  address   = {Basel},
  isbn      = {978-3-03943-029-1},
  doi       = {10.3390/books978-3-03943-029-1},
  pages     = {122 Pages},
  year      = {2020},
  language  = {en}
}
@book{GebhardtKesslerThurn2019,
  author    = {Gebhardt, Andreas and Kessler, Julia and Thurn, Laura},
  title     = {3D printing : understanding additive manufacturing},
  edition   = {2. Auflage},
  publisher = {Hanser},
  address   = {M{\"u}nchen},
  isbn      = {978-1-56990-702-3},
  pages     = {XVI, 204 Seiten},
  year      = {2019},
  language  = {en}
}
@book{WagemannTippkoetter2019,
  author    = {Wagemann, Kurt and Tippk{\"o}tter, Nils},
  title     = {Biorefineries / Kurt Wagemann, Nils Tippk{\"o}tter (editors)},
  series = {Advances in biochemical engineering/biotechnology book series (ABE)},
  journal   = {Advances in biochemical engineering/biotechnology book series (ABE)},
  publisher = {Springer},
  address   = {Cham (Switzerland)},
  isbn      = {978-3-319-97117-9},
  doi       = {10.1007/978-3-319-97119-3},
  pages     = {VI, 549 Seiten},
  year      = {2019},
  language  = {en}
}
@book{MeskourisButenwegHinzenetal.2019,
  author    = {Meskouris, Konstantin and Butenweg, Christoph and Hinzen, Klaus-G. and H{\"o}ffer, R{\"u}diger},
  title     = {Structural Dynamics with Applications in Earthquake and Wind Engineering},
  publisher = {Springer},
  address   = {Berlin, Heidelberg},
  isbn      = {978-3-662-57550-5},
  doi       = {10.1007/978-3-662-57550-5},
  year      = {2019},
  language  = {en}
}
@book{StaatErni2019,
  author    = {Staat, Manfred and Erni, Daniel},
  title     = {Symposium Proceedings; 3rd YRA MedTech Symposium 2019: May 24 / 2019 / FH Aachen},
  publisher = {Universit{\"a}t Duisburg-Essen},
  address   = {Duisburg},
  organization    = {MedTech Symposium},
  isbn      = {978-3-940402-22-6},
  doi       = {10.17185/duepublico/48750},
  pages     = {49 Seiten},
  year      = {2019},
  language  = {en}
}
@book{Huening2018,
  author    = {H{\"u}ning, Felix},
  title     = {Embedded Design For IoT With Renesas Synergy},
  publisher = {Renesas Electronics},
  address   = {D{\"u}sseldorf},
  pages     = {143 S.},
  year      = {2018},
  language  = {en}
}
@book{ArtmannTemizArtmannZhubanovaetal.2018,
  author    = {Artmann, Gerhard and Temiz Artmann, Ayseg{\"u}l and Zhubanova, Azhar A. and Digel, Ilya},
  title     = {Biological, physical and technical basics of cell engineering},
  editor    = {Artmann, Gerhard and Temiz Artmann, Ayseg{\"u}l and Zhubanova, Azhar A. and Digel, Ilya},
  publisher = {Springer},
  address   = {Singapore},
  isbn      = {978-981-10-7903-0},
  pages     = {xxiv, 481 Seiten ; Illustrationen, Diagramme},
  year      = {2018},
  language  = {en}
}
@book{SchoeningPoghossian2018,
  author    = {Sch{\"o}ning, Michael Josef and Poghossian, Arshak},
  title     = {Label-free biosensing: advanced materials, devices and applications},
  publisher = {Springer},
  address   = {Cham},
  isbn      = {978-3-319-75219-8},
  pages     = {xii, 480 Seiten ; Illustrationen, Diagramme},
  year      = {2018},
  language  = {en}
}
@book{CzarneckiDietze2017,
  author    = {Czarnecki, Christian and Dietze, Christian},
  title     = {Reference architecture for the telecommunications industry: Transformation of strategy, organization, processes, data, and applications},
  publisher = {Springer},
  address   = {Cham},
  isbn      = {978-3-319-46755-9 (Print)},
  doi       = {10.1007/978-3-319-46757-3},
  pages     = {XXII, 253 Seiten},
  year      = {2017},
  abstract  = {This book reflects the tremendous changes in the telecommunications industry in the course of the past few decades - shorter innovation cycles, stiffer competition and new communication products. It analyzes the transformation of processes, applications and network technologies that are now expected to take place under enormous time pressure. The International Telecommunication Union (ITU) and the TM Forum have provided reference solutions that are broadly recognized and used throughout the value chain of the telecommunications industry, and which can be considered the de facto standard. The book describes how these reference solutions can be used in a practical context: it presents the latest insights into their development, highlights lessons learned from numerous international projects and combines them with well-founded research results in enterprise architecture management and reference modeling. The complete architectural transformation is explained, from the planning and set-up stage to the implementation. Featuring a wealth of examples and illustrations, the book offers a valuable resource for telecommunication professionals, enterprise architects and project managers alike.},
  language  = {en}
}
@book{GebhardtHoetter2016,
  author    = {Gebhardt, Andreas and H{\"o}tter, Jan-Steffen},
  title     = {Additive manufacturing : 3D printing for prototyping and manufacturing},
  publisher = {Hanser Publishers},
  address   = {Munich},
  isbn      = {978-1-56990-582-1 ; 978-1-56990-583-8},
  pages     = {591 S.},
  year      = {2016},
  language  = {en}
}