@inproceedings{BudaSchuermannWollert2008, author = {Buda, Aurel and Sch{\"u}rmann, Volker and Wollert, J{\"o}rg}, title = {A middleware approach for industrial wireless automation networks}, series = {Proceedings of the Eighth IASTED International Conference on Wireless \& Optical Communications : May 26 - 28, 2008, Qu{\´e}bec City, Quebec, Canada}, booktitle = {Proceedings of the Eighth IASTED International Conference on Wireless \& Optical Communications : May 26 - 28, 2008, Qu{\´e}bec City, Quebec, Canada}, publisher = {Acta Pr.}, address = {Anaheim, Calif.}, organization = {International Association of Science and Technology for Development}, isbn = {978-0-88986-743-7}, pages = {76 -- 82}, year = {2008}, language = {de} } @inproceedings{ChavezBermudezWollert2022, author = {Chavez Bermudez, Victor Francisco and Wollert, J{\"o}rg}, title = {10BASE-T1L industry 4.0 smart switch for field devices based on IO-Link}, series = {2022 IEEE 18th International Conference on Factory Communication Systems (WFCS)}, booktitle = {2022 IEEE 18th International Conference on Factory Communication Systems (WFCS)}, publisher = {IEEE}, isbn = {978-1-6654-1086-1}, doi = {10.1109/WFCS53837.2022.9779176}, pages = {4 Seiten}, year = {2022}, abstract = {The recent amendment to the Ethernet physical layer known as the IEEE 802.3cg specification, allows to connect devices up to a distance of one kilometer and delivers a maximum of 60 watts of power over a twisted pair of wires. This new standard, also known as 10BASE-TIL, promises to overcome the limits of current physical layers used for field devices and bring them a step closer to Ethernet-based applications. The main advantage of 10BASE- TIL is that it can deliver power and data over the same line over a long distance, where traditional solutions (e.g., CAN, IO-Link, HART) fall short and cannot match its 10 Mbps bandwidth. Due to its recentness, IOBASE- TIL is still not integrated into field devices and it has been less than two years since silicon manufacturers released the first Ethernet-PHY chips. In this paper, we present a design proposal on how field devices could be integrated into a IOBASE-TIL smart switch that allows plug-and-play connectivity for sensors and actuators and is compliant with the Industry 4.0 vision. Instead of presenting a new field-level protocol for this work, we have decided to adopt the IO-Link specification which already includes a plug-and-play approach with features such as diagnosis and device configuration. The main objective of this work is to explore how field devices could be integrated into 10BASE-TIL Ethernet, its adaption with a well-known protocol, and its integration with Industry 4.0 technologies.}, language = {en} } @inproceedings{Wollert2001, author = {Wollert, J{\"o}rg}, title = {10 Regeln f{\"u}r das Desaster}, series = {Logistik IT Erfolgsfaktor oder Risiko? : Tagung R{\"u}sselsheim, 14. und 15. November 2001. (VDI-Berichte ; 1633)}, booktitle = {Logistik IT Erfolgsfaktor oder Risiko? : Tagung R{\"u}sselsheim, 14. und 15. November 2001. (VDI-Berichte ; 1633)}, publisher = {VDI-Verl.}, address = {D{\"u}sseldorf}, organization = {Gesellschaft F{\"o}rdertechnik, Materialfluss und Logistik}, isbn = {3-18-091633-8}, pages = {1 -- 16}, year = {2001}, language = {de} }