@inproceedings{ChavezBermudezWollert2020,
  author    = {Chavez Bermudez, Victor Francisco and Wollert, J{\"o}rg},
  title     = {Arduino based Framework for Rapid Application Development of a Generic IO-Link interface},
  series = {Kommunikation und Bildverarbeitung in der Automation},
  booktitle = {Kommunikation und Bildverarbeitung in der Automation},
  publisher = {Springer Vieweg},
  address   = {Berlin},
  isbn      = {978-3-662-59895-5},
  doi       = {10.1007/978-3-662-59895-5_2},
  pages     = {21 -- 33},
  year      = {2020},
  abstract  = {The implementation of IO-Link in the automation industry has increased over the years. Its main advantage is it offers a digital point-to-point plugand-play interface for any type of device or application. This simplifies the communication between devices and increases productivity with its different features like self-parametrization and maintenance. However, its complete potential is not always used. The aim of this paper is to create an Arduino based framework for the development of generic IO-Link devices and increase its implementation for rapid prototyping. By generating the IO device description file (IODD) from a graphical user interface, and further customizable options for the device application, the end-user can intuitively develop generic IO-Link devices. The peculiarity of this framework relies on its simplicity and abstraction which allows to implement any sensor functionality and virtually connect any type of device to an IO-Link master. This work consists of the general overview of the framework, the technical background of its development and a proof of concept which demonstrates the workflow for its implementation.},
  language  = {en}
}
@article{ScheikSchleserReisgen2012,
  author    = {Scheik, Sven and Schleser, Markus and Reisgen, Uwe},
  title     = {Thermisches Direktf{\"u}gen von Metall und Kusntstoff: eine Alternative zur Klebtechnik},
  series = {Adh{\"a}sion : Kleben \& Dichten},
  volume    = {56},
  journal   = {Adh{\"a}sion : Kleben \& Dichten},
  number    = {11},
  publisher = {Springer Vieweg},
  address   = {Wiesbaden},
  issn      = {0001-8198 (E-Journal); 0001-8198 (Print)},
  doi       = {10.1007/s35145-012-0005-x},
  pages     = {36 -- 40},
  year      = {2012},
  abstract  = {Im Rahmen des Exzellenzclusters „Integrative Produktionstechnik f{\"u}r Hochlohnl{\"a}nder" der RWTHAachen University werden derzeit alternative Verfahren zur Herstellung von Metall/Kunststoff- Verbindungen untersucht. Eines davon ist das thermische Direktf{\"u}gen, das eine stoffschl{\"u}ssige Verbindung zwischen Kunststoff und Metall erm{\"o}glicht und ohne die Verwendung von Klebstoffen, Haftvermittlern oder mechanischen Verbindungshilfen auskommt.},
  language  = {de}
}