TY  - JOUR
A1  - Scheik, Sven
A1  - Schleser, Markus
A1  - Reisgen, Uwe
T1  - Thermisches Direktfügen von Metall und Kusntstoff: eine Alternative zur Klebtechnik
JF  - Adhäsion : Kleben & Dichten
N2  - Im Rahmen des Exzellenzclusters „Integrative Produktionstechnik für Hochlohnländer“ der RWTHAachen University werden derzeit alternative Verfahren zur Herstellung von Metall/Kunststoff- Verbindungen untersucht. Eines davon ist das thermische Direktfügen, das eine stoffschlüssige Verbindung zwischen Kunststoff und Metall ermöglicht und ohne die Verwendung von Klebstoffen, Haftvermittlern oder mechanischen Verbindungshilfen auskommt.
Y1  - 2012
U6  - http://dx.doi.org/10.1007/s35145-012-0005-x
SN  - 0001-8198 (E-Journal); 0001-8198 (Print)
N1  - Printausg. in der Bibliothek der FH Aachen vorhanden: 63 Z 807-2012
VL  - 56
IS  - 11
SP  - 36
EP  - 40
PB  - Springer Vieweg
CY  - Wiesbaden
ER  - 
TY  - CHAP
A1  - Chavez Bermudez, Victor Francisco
A1  - Wollert, Jörg
T1  - Arduino based Framework for Rapid Application Development of a Generic IO-Link interface
T2  - Kommunikation und Bildverarbeitung in der Automation
N2  - The implementation of IO-Link in the automation industry has increased over the years. Its main advantage is it offers a digital point-to-point plugand-play interface for any type of device or application. This simplifies the communication between devices and increases productivity with its different features like self-parametrization and maintenance. However, its complete potential is not always used.

The aim of this paper is to create an Arduino based framework for the development of generic IO-Link devices and increase its implementation for rapid prototyping. By generating the IO device description file (IODD) from a graphical user interface, and further customizable options for the device application, the end-user can intuitively develop generic IO-Link devices. The peculiarity of this framework relies on its simplicity and abstraction which allows to implement any sensor functionality and virtually connect any type of device to an IO-Link master. This work consists of the general overview of the framework, the technical background of its development and a proof of concept which demonstrates the workflow for its implementation.
Y1  - 2020
SN  - 978-3-662-59895-5
SN  - 978-3-662-59894-8
U6  - http://dx.doi.org/10.1007/978-3-662-59895-5_2
N1  - Teil der Buchserie "Technologien für die intelligente Automation" (TIA,volume 12)
SP  - 21
EP  - 33
PB  - Springer Vieweg
CY  - Berlin
ER  -