TY - CHAP A1 - Gebhardt, Andreas T1 - Technology Diffusion through a Multi-Level Technology Transfer Infrastructure. Contribution to the 1st. All Africa Technology Diffusion Conference Boksburg, South Africa June 12th - 14th 2006 N2 - Table of contents 1. Introduction 2. Multi-level Technology Transfer Infrastructure 2.1 Level 1: University Education – Encourage the Idea of becoming an Entrepreneur 2.2 Level 2: Post Graduate Education – Improve your skills and focus it on a product family. 2.3 Level 3: Birth of a Company – Focus your skills on a product and a market segment. 2.4 Level 4: Ready to stand alone – Set up your own business 2.5 Level 5: Grow to be Strong – Develop your business 2.6 Level 6: Competitive and independent – Stay innovative. 3. Samples 3.1 Sample 1: Laser Processing and Consulting Centre, LBBZ 3.2 Sample 2: Prototyping Centre, CP 4. Funding - Waste money or even lost Money? 5. Conclusion KW - Technologietransfer KW - technology transfer KW - technology diffusion Y1 - 2006 ER - TY - CHAP A1 - Staat, Manfred T1 - Problems and chances for probabilistic fracture mechanics in the analysis of steel pressure boundary reliability. - Überarb. Ausg. N2 - In: Technical feasibility and reliability of passive safety systems for nuclear power plants. Proceedings of an Advisory Group Meeting held in Jülich, 21-24 November 1994. - Vienna , 1996. - Seite: 43 - 55 IAEA-TECDOC-920 Abstract: It is shown that the difficulty for probabilistic fracture mechanics (PFM) is the general problem of the high reliability of a small population. There is no way around the problem as yet. Therefore what PFM can contribute to the reliability of steel pressure boundaries is demon­strated with the example of a typical reactor pressure vessel and critically discussed. Although no method is distinguishable that could give exact failure probabilities, PFM has several addi­tional chances. Upper limits for failure probability may be obtained together with trends for design and operating conditions. Further, PFM can identify the most sensitive parameters, improved control of which would increase reliability. Thus PFM should play a vital role in the analysis of steel pressure boundaries despite all shortcomings. KW - Bruchmechanik KW - probabilistic fracture mechanics KW - PFM Y1 - 2006 ER - TY - CHAP A1 - Becker, Astrid T1 - Anlagenmanagement und Aufgaben der DB Netz AG, Bauherrenvertretung und Wirtschaftlichkeit N2 - In: Alfha.net / Sektion Bauingenieurwesen: 1. [Erster] Erfahrungsaustausch : Absolventen des Fachbereichs Bauingenieurwesens berichten. 13. Oktober 2006. S. 18 Übersicht des Vortrags KW - Anlagenwirtschaft KW - Bauherrenvertretung KW - Deutsche Bahn Netz AG Y1 - 2006 ER - TY - CHAP A1 - Wellmann, Judith T1 - Perspektiven eines Bauingenieurs im konstruktiven Ingenieurbau N2 - In: Alfha.net / Sektion Bauingenieurwesen: 1. [Erster] Erfahrungsaustausch : Absolventen des Fachbereichs Bauingenieurwesens berichten. 13. Oktober 2006. S. 7-12 Die Berufsperspektiven im konstruktiven Ingenieurbau werden trotz sinkendem Bedarf an Statikern positiv bewertet. KW - Ingenieurbau KW - Konstruktiver Ingenieurbau KW - Statiker KW - Berufsperspektiven Y1 - 2006 ER - TY - CHAP A1 - Merten, Sabine A1 - Kämper, Klaus-Peter A1 - Brill, Manfred A1 - Picard, Antoni A1 - Cassel, Detlev A1 - Jentsch, Andreas A1 - Rollwa, Markus T1 - Virtuelle Sensor-Fertigung: Hightech mit LabVIEW N2 - Eine neue Generation von Praktika an Hochschulen wächst heran. Moderne Wege beim Verstehen und Erlernen naturwissenschaftlicher Zusammenhänge sowie industrieller Fertigungsprozesse sind gefordert. Das Technologiepraktikum „Virtuelle Sensor- Fertigung“, entwickelt im Verbundprojekt INGMEDIA an den Fachhochschulen Aachen und Zweibrücken, trägt als neuartiges Lern- und Lehrmodul dieser Forderung Rechnung. Die Studierenden lernen einen vollständigen Fertigungsprozess mit Hilfe von virtuellen, in LabVIEW programmierten Maschinen kennen, bevor sie die reale Prozesskette im Reinraum durchführen. N2 - A new generation of university laboratory courses is presently being developed. Modern concepts for the understanding and learning of applied science and industrial fabrication processes are required. The technology course “Fabrication of a microsensor”, developed by the Universities of Applied Sciences Aachen and Zweibrücken in the joint research project INGMEDIA, represents a new approach towards education in high technology production. The students learn the operation of the complex microfabrication line with the help of virtual fabrication machines, programmed in LabVIEW, before they perform the actual process in a genuine clean room. KW - LabVIEW KW - Virtuelle Sensor-Fertigung KW - Fertigungsprozess KW - virtuelle Maschinen KW - virtual sensor fabrication KW - manufacturing process KW - virtual KW - virtual machines Y1 - 2003 ER - TY - CHAP A1 - Merten, Sabine A1 - Kämper, Klaus-Peter A1 - Brill, Manfred A1 - Picard, Antoni A1 - Cassel, Detlev A1 - Jentsch, Andreas A1 - Rollwa, Markus T1 - Vom virtuellen Wafer zum realen Drucksensor N2 - Das Technologiepraktikum „Virtuelle Sensor-Fertigung“ ist ein Beispiel für die medientechnische Aufbereitung von Lern- und Lehrmaterial unter didaktischen Gesichtspunkten. Studierende lernen einen Fertigungsprozess mit Hilfe von virtuellen Maschinen kennen, bevor sie die reale Prozesskette im Laborpraktikum im Reinraum durchführen. N2 - The technology course “Fabrication of a microsensor” represents a multimediabased approach towards education in high technology production in consideration of didactical aspects. The students learn the operation of a complex microfabrication line with the help of virtual fabrication machines before they perform the actual process in a hands-on training in an actual clean room. KW - Virtuelle Maschine KW - VM KW - Virtuelle Sensor-Fertigung KW - virtual fabrication of a microsensor Y1 - 2003 ER - TY - CHAP A1 - Staat, Manfred T1 - Design by Analysis of Pressure Components by non-linear Optimization N2 - This paper presents the direct route to Design by Analysis (DBA) of the new European pressure vessel standard in the language of limit and shakedown analysis (LISA). This approach leads to an optimization problem. Its solution with Finite Element Analysis is demonstrated for some examples from the DBA-Manual. One observation from the examples is, that the optimisation approach gives reliable and close lower bound solutions leading to simple and optimised design decision. KW - Analytischer Zulaessigkeitsnachweis KW - FEM KW - Einspiel-Analyse KW - design-by-analysis KW - finite element analysis KW - limit and shakedown analysis Y1 - 2003 ER - TY - CHAP A1 - Fabo, Sabine T1 - Audio-visual hybrids : between immersion and detachment N2 - Close interrelations between sound and image are not a mere phenomenon of today’s multimedia technology. The idea of the synthesis of different media lies at the core of the concept of the Gesamtkunstwerk in the second half of the 19th century and it can also be traced back to the synaesthesia debate at the beginning of the 20th century [...]. KW - Elektronische Kunst KW - Klangkunst KW - Hybride Kunst KW - Medienkunst KW - Hybrid Art KW - Sound Art KW - Audio-visual Art Y1 - 2004 ER - TY - CHAP A1 - Poghossian, Arshak A1 - Schumacher, Kerstin A1 - Kloock, Joachim P. A1 - Rosenkranz, Christian A1 - Schultze, Joachim W. A1 - Müller-Veggian, Mattea A1 - Schöning, Michael Josef T1 - Functional testing and characterisation of ISFETs on wafer level by means of a micro-droplet cell N2 - A wafer-level functionality testing and characterisation system for ISFETs (ionsensitive field-effect transistor) is realised by means of integration of a specifically designed capillary electrochemical micro-droplet cell into a commercial wafer prober-station. The developed system allows the identification and selection of “good” ISFETs at the earliest stage and to avoid expensive bonding, encapsulation and packaging processes for nonfunctioning ISFETs and thus, to decrease costs, which are wasted for bad dies. The developed system is also feasible for wafer-level characterisation of ISFETs in terms of sensitivity, hysteresis and response time. Additionally, the system might be also utilised for wafer-level testing of further electrochemical sensors. KW - Biosensor KW - Biosensorik KW - ISFET KW - Wafer KW - ISFET KW - wafer-level testing KW - capillary micro-droplet cell Y1 - 2006 U6 - http://nbn-resolving.de/urn/resolver.pl?urn:nbn:de:hbz:a96-opus-1259 ER - TY - CHAP A1 - Wagner, Torsten A1 - Schöning, Michael Josef T1 - Preface of the Special Issue of I3S 2005 in Jülich (Germany) N2 - International Symposium on Sensor Science, I3S 2005 <3; 2005; Juelich, Germany> In: Sensors 2006, 6, 260-261 ISSN 1424-8220 KW - Biosensor KW - I3S 2005 KW - International Symposium on Sensor Science Y1 - 2006 U6 - http://nbn-resolving.de/urn/resolver.pl?urn:nbn:de:hbz:a96-opus-1365 ER -