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Verfahren und Vorrichtung zu Temperierung von Bauteilen : Offenlegungsschrift

Device for tempering of component parts in which continuous gap exists between outer contour of pipe element and cavity contour of mineral component has arrangement whereby gap is filled completely with cellular material

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Metadaten
Author:Bernd Döring, Oliver Hechler
Publisher:Deutsches Patent- und Markenamt
Place of publication:München
Document Type:Patent
Language:German
Year of Completion:2003
Date of the Publication (Server):2013/12/05
Length:9 S. : graph. Darst.
Link:https://depatisnet.dpma.de/DepatisNet/depatisnet?action=bibdat&docid=DE000010328734A1
Zugriffsart:weltweit
Institutes:FH Aachen / Fachbereich Bauingenieurwesen
Patent Number:DE10328734A1
Country of Patent Application:DE
Patent Year applied:2003
PatentApplication:25.06.2003