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A concept for a sensitive micro total analysis system for high throughput fluorescence imaging
(2006)
This paper discusses possible methods for on-chip fluorescent imaging for integrated bio-sensors. The integration of optical and electro-optical accessories, according to suggested methods, can improve the performance of fluorescence imaging. It can boost the signal to background ratio by a few orders of magnitudes in comparison to conventional discrete setups. The methods that are present in this paper are oriented towards building reproducible arrays for high-throughput micro total analysis systems (µTAS). The first method relates to side illumination of the fluorescent material placed into microcompartments of the lab-on-chip. Its significance is in high utilization of excitation energy for low concentration of fluorescent material. The utilization of a transparent µLED chip, for the second method, allows the placement of the excitation light sources on the same optical axis with emission detector, such that the excitation and emission rays are directed controversly. The third method presents a spatial filtering of the excitation background.
Functional testing and characterisation of ISFETs on wafer level by means of a micro-droplet cell
(2006)
A wafer-level functionality testing and characterisation system for ISFETs (ionsensitive field-effect transistor) is realised by means of integration of a specifically designed capillary electrochemical micro-droplet cell into a commercial wafer prober-station. The developed system allows the identification and selection of “good” ISFETs at the earliest stage and to avoid expensive bonding, encapsulation and packaging processes for nonfunctioning ISFETs and thus, to decrease costs, which are wasted for bad dies. The developed system is also feasible for wafer-level characterisation of ISFETs in terms of sensitivity, hysteresis and response time. Additionally, the system might be also utilised for wafer-level testing of further electrochemical sensors.
In: Alfha.net / Sektion Bauingenieurwesen: 1. [Erster] Erfahrungsaustausch : Absolventen des Fachbereichs Bauingenieurwesens berichten. 13. Oktober 2006. S. 19-20. Zusammenfassung des Vortrags: Prozessanalyse und Revision beim Umbau des Flughafens Hamburg, Beratung von Bauunternehmen, Sachverständigentätigkeit