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Chromatography is the workhorse of biopharmaceutical downstream processing because it can selectively enrich a target product while removing impurities from complex feed streams. This is achieved by exploiting differences in molecular properties, such as size, charge and hydrophobicity (alone or in different combinations). Accordingly, many parameters must be tested during process development in order to maximize product purity and recovery, including resin and ligand types, conductivity, pH, gradient profiles, and the sequence of separation operations. The number of possible experimental conditions quickly becomes unmanageable. Although the range of suitable conditions can be narrowed based on experience, the time and cost of the work remain high even when using high-throughput laboratory automation. In contrast, chromatography modeling using inexpensive, parallelized computer hardware can provide expert knowledge, predicting conditions that achieve high purity and efficient recovery. The prediction of suitable conditions in silico reduces the number of empirical tests required and provides in-depth process understanding, which is recommended by regulatory authorities. In this article, we discuss the benefits and specific challenges of chromatography modeling. We describe the experimental characterization of chromatography devices and settings prior to modeling, such as the determination of column porosity. We also consider the challenges that must be overcome when models are set up and calibrated, including the cross-validation and verification of data-driven and hybrid (combined data-driven and mechanistic) models. This review will therefore support researchers intending to establish a chromatography modeling workflow in their laboratory.
Proteins are important ingredients in food and feed, they are the active components of many pharmaceutical products, and they are necessary, in the form of enzymes, for the success of many technical processes. However, production can be challenging, especially when using heterologous host cells such as bacteria to express and assemble recombinant mammalian proteins. The manufacturability of proteins can be hindered by low solubility, a tendency to aggregate, or inefficient purification. Tools such as in silico protein engineering and models that predict separation criteria can overcome these issues but usually require the complex shape and surface properties of proteins to be represented by a small number of quantitative numeric values known as descriptors, as similarly used to capture the features of small molecules. Here, we review the current status of protein descriptors, especially for application in quantitative structure activity relationship (QSAR) models. First, we describe the complexity of proteins and the properties that descriptors must accommodate. Then we introduce descriptors of shape and surface properties that quantify the global and local features of proteins. Finally, we highlight the current limitations of protein descriptors and propose strategies for the derivation of novel protein descriptors that are more informative.
Mit der Digitalen Automatischen Kupplung beginnt ein neues Kapitel des Schienengüterverkehrs, in dem zusammengestellte Wagen sich automatisch in wenigen Minuten abfahrbereit machen, ohne dass der Mensch eingreifen muss. Eines des größten Hemmnisse der umweltfreundlichen Schiene wird dann entfallen. Notwendig ist jetzt eine Diskussion über den Umfang und die Systemgrenzen der Automatischen Bremsprobe.
Lokomotiven sind dank modernster Konzepte der Antriebstechnik heute energiesparend und umweltfreundlich. Eine Ausrüstung mit Telematik und Assistenzfunktionen ist Standard. Auf der Strecke zeigt sich moderne Technik in Form elektronischer Stellwerke und Zugsicherungssysteme und in Rangier- und Abstellanlagen als EOW-Technik. Am Güterwagen hingegen ist der technische Fortschritt komplett vorbeigegangen. Auch beim modernsten Wagen (Abb. 1) ist die einzige „Automatik“-Funktion die zentral über die Hauptluftleitung (HL) versorgte und betätigte Luftbremse.
The thermal conductivity of components manufactured using Laser Powder Bed Fusion (LPBF), also called Selective Laser Melting (SLM), plays an important role in their processing. Not only does a reduced thermal conductivity cause residual stresses during the process, but it also makes subsequent processes such as the welding of LPBF components more difficult. This article uses 316L stainless steel samples to investigate whether and to what extent the thermal conductivity of specimens can be influenced by different LPBF parameters. To this end, samples are set up using different parameters, orientations, and powder conditions and measured by a heat flow meter using stationary analysis. The heat flow meter set-up used in this study achieves good reproducibility and high measurement accuracy, so that comparative measurements between the various LPBF influencing factors to be tested are possible. In summary, the series of measurements show that the residual porosity of the components has the greatest influence on conductivity. The degradation of the powder due to increased recycling also appears to be detectable. The build-up direction shows no detectable effect in the measurement series.
In times of short product life cycles, additive manufacturing and rapid tooling are important methods to make tool development and manufacturing more efficient. High-performance polymers are the key to mold production for prototypes and small series. However, the high temperatures during vulcanization injection molding cause thermal aging and can impair service life. The extent to which the thermal stress over the entire process chain stresses the material and whether it leads to irreversible material aging is evaluated. To this end, a mold made of PEEK is fabricated using fused filament fabrication and examined for its potential application. The mold is heated to 200 ◦C, filled with rubber, and cured. A differential scanning calorimetry analysis of each process step illustrates the crystallization behavior and first indicates the material resistance. It shows distinct cold crystallization regions at a build chamber temperature of 90 ◦C. At an ambient temperature above Tg, crystallization of 30% is achieved, and cold crystallization no longer occurs. Additional tensile tests show a decrease in tensile strength after ten days of thermal aging. The steady decrease in recrystallization temperature indicates degradation of the additives. However, the tensile tests reveal steady embrittlement of the material due to increasing crosslinking.