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Praktische Untersuchungen zum zeitlichen Übertragungs- und Bündelfehlerverhalten der IEEE 802.15.4
(2006)
This paper presents the laser-based powder bed fusion (L-PBF) using various glass powders (borosilicate and quartz glass). Compared to metals, these require adapted process strategies. First, the glass powders were characterized with regard to their material properties and their processability in the powder bed. This was followed by investigations of the melting behavior of the glass powders with different laser wavelengths (10.6 µm, 1070 nm). In particular, the experimental setup of a CO2 laser was adapted for the processing of glass powder. An experimental setup with integrated coaxial temperature measurement/control and an inductively heatable build platform was created. This allowed the L-PBF process to be carried out at the transformation temperature of the glasses. Furthermore, the component’s material quality was analyzed on three-dimensional test specimen with regard to porosity, roughness, density and geometrical accuracy in order to evaluate the developed L-PBF parameters and to open up possible applications.
The development of protype applications with sensors and actuators in the automation industry requires tools that are independent of manufacturer, and are flexible enough to be modified or extended for any specific requirements. Currently, developing prototypes with industrial sensors and actuators is not straightforward. First of all, the exchange of information depends on the industrial protocol that these devices have. Second, a specific configuration and installation is done based on the hardware that is used, such as automation controllers or industrial gateways. This means that the development for a specific industrial protocol, highly depends on the hardware and the software that vendors provide. In this work we propose a rapid-prototyping framework based on Arduino to solve this problem. For this project we have focused to work with the IO-Link protocol. The framework consists of an Arduino shield that acts as the physical layer, and a software that implements the IO-Link Master protocol. The main advantage of such framework is that an application with industrial devices can be rapid-prototyped with ease as its vendor independent, open-source and can be ported easily to other Arduino compatible boards. In comparison, a typical approach requires proprietary hardware, is not easy to port to another system and is closed-source.