Fachbereich Maschinenbau und Mechatronik
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The aim of this work was to perform a detailed investigation of the use of Selective Laser Melting (SLM) technology to process eutectic silver-copper alloy Ag 28 wt. % Cu (also called AgCu28). The processing occurred with a Realizer SLM 50 desktop machine. The powder analysis (SEM-topography, EDX, particle distribution) was reported as well as the absorption rates for the near-infrared (NIR) spectrum. Microscope imaging showed the surface topography of the manufactured parts. Furthermore, microsections were conducted for the analysis of porosity. The Design of Experiments approach used the response surface method in order to model the statistical relationship between laser power, spot distance and pulse time.
Das IoT ist ohne eingebettete Systeme undenkbar. Erst kleine und kleinste Mikrocontroller mit intelligenten Kommunikationsschnittstellen und Anbindung ans Internet ermöglichen sinnvolles und flächendeckendes Einsammeln von Daten. Doch wie kompliziert ist der Einstieg in die Embedded-Welt? Dieser Artikel gibt Einblick, wie die »Arduino-Plattform« die Einstiegshürden für eingebettete Systeme dramatisch reduzieren kann.