Fachbereich Maschinenbau und Mechatronik
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Laser-based Additive Manufacturing (AM) processes for the use of metals out of the powder bed have been investigated profusely and are prevalent in industry. Although there is a broad field of application, Laser Powder Bed Fusion (LPBF), also known as Selective Laser Melting (SLM) of glass is not fully developed yet. The material properties of glass are significantly different from the investigated metallic material for LPBF so far. As such, the process cannot be transferred, and the parameter limits and the process sequence must be redefined for glass. Starting with the characterization of glass powders, a parameter field is initially confined to investigate the process parameter of different glass powder using LPBFprocess. A feasibility study is carried out to process borosilicate glass powder. The effects of process parameters on the dimensional accuracy of fabricated parts out of borosilicate and hints for the post-processing are analysed and presented in this paper.
Application of polymers in textile reinforced concrete : from the interface to construction elements
(2006)
Composite improvement of textile reinforced concrete by polymeric impregnation of the textiles
(2006)
Additive Manufacturing (AM) of metallic workpieces faces a continuously rising technological relevance and market size. Producing complex or highly strained unique workpieces is a significant field of application, making AM highly relevant for tool components. Its successful economic application requires systematic workpiece based decisions and optimizations. Considering geometric and technological requirements as well as the necessary post-processing makes deciding effortful and requires in-depth knowledge. As design is usually adjusted to established manufacturing, associated technological and strategic potentials are often neglected. To embed AM in a future proof industrial environment, software-based self-learning tools are necessary. Integrated into production planning, they enable companies to unlock the potentials of AM efficiently. This paper presents an appropriate methodology for the analysis of process-specific AM-eligibility and optimization potential, added up by concrete optimization proposals. For an integrated workpiece characterization, proven methods are enlarged by tooling-specific figures.
The first stage of the approach specifies the model’s initialization. A learning set of tooling components is described using the developed key figure system. Based on this, a set of applicable rules for workpiece-specific result determination is generated through clustering and expert evaluation. Within the following application stage, strategic orientation is quantified and workpieces of interest are described using the developed key figures. Subsequently, the retrieved information is used for automatically generating specific recommendations relying on the generated ruleset of stage one. Finally, actual experiences regarding the recommendations are gathered within stage three. Statistic learning transfers those to the generated ruleset leading to a continuously deepening knowledge base. This process enables a steady improvement in output quality.
The implementation of IO-Link in the automation industry has increased over the years. Its main advantage is it offers a digital point-to-point plugand-play interface for any type of device or application. This simplifies the communication between devices and increases productivity with its different features like self-parametrization and maintenance. However, its complete potential is not always used.
The aim of this paper is to create an Arduino based framework for the development of generic IO-Link devices and increase its implementation for rapid prototyping. By generating the IO device description file (IODD) from a graphical user interface, and further customizable options for the device application, the end-user can intuitively develop generic IO-Link devices. The peculiarity of this framework relies on its simplicity and abstraction which allows to implement any sensor functionality and virtually connect any type of device to an IO-Link master. This work consists of the general overview of the framework, the technical background of its development and a proof of concept which demonstrates the workflow for its implementation.
The recent amendment to the Ethernet physical layer known as the IEEE 802.3cg specification, allows to connect devices up to a distance of one kilometer and delivers a maximum of 60 watts of power over a twisted pair of wires. This new standard, also known as 10BASE-TIL, promises to overcome the limits of current physical layers used for field devices and bring them a step closer to Ethernet-based applications. The main advantage of 10BASE- TIL is that it can deliver power and data over the same line over a long distance, where traditional solutions (e.g., CAN, IO-Link, HART) fall short and cannot match its 10 Mbps bandwidth. Due to its recentness, IOBASE- TIL is still not integrated into field devices and it has been less than two years since silicon manufacturers released the first Ethernet-PHY chips. In this paper, we present a design proposal on how field devices could be integrated into a IOBASE-TIL smart switch that allows plug-and-play connectivity for sensors and actuators and is compliant with the Industry 4.0 vision. Instead of presenting a new field-level protocol for this work, we have decided to adopt the IO-Link specification which already includes a plug-and-play approach with features such as diagnosis and device configuration. The main objective of this work is to explore how field devices could be integrated into 10BASE-TIL Ethernet, its adaption with a well-known protocol, and its integration with Industry 4.0 technologies.
The development of protype applications with sensors and actuators in the automation industry requires tools that are independent of manufacturer, and are flexible enough to be modified or extended for any specific requirements. Currently, developing prototypes with industrial sensors and actuators is not straightforward. First of all, the exchange of information depends on the industrial protocol that these devices have. Second, a specific configuration and installation is done based on the hardware that is used, such as automation controllers or industrial gateways. This means that the development for a specific industrial protocol, highly depends on the hardware and the software that vendors provide. In this work we propose a rapid-prototyping framework based on Arduino to solve this problem. For this project we have focused to work with the IO-Link protocol. The framework consists of an Arduino shield that acts as the physical layer, and a software that implements the IO-Link Master protocol. The main advantage of such framework is that an application with industrial devices can be rapid-prototyped with ease as its vendor independent, open-source and can be ported easily to other Arduino compatible boards. In comparison, a typical approach requires proprietary hardware, is not easy to port to another system and is closed-source.