Fachbereich Maschinenbau und Mechatronik
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The development of protype applications with sensors and actuators in the automation industry requires tools that are independent of manufacturer, and are flexible enough to be modified or extended for any specific requirements. Currently, developing prototypes with industrial sensors and actuators is not straightforward. First of all, the exchange of information depends on the industrial protocol that these devices have. Second, a specific configuration and installation is done based on the hardware that is used, such as automation controllers or industrial gateways. This means that the development for a specific industrial protocol, highly depends on the hardware and the software that vendors provide. In this work we propose a rapid-prototyping framework based on Arduino to solve this problem. For this project we have focused to work with the IO-Link protocol. The framework consists of an Arduino shield that acts as the physical layer, and a software that implements the IO-Link Master protocol. The main advantage of such framework is that an application with industrial devices can be rapid-prototyped with ease as its vendor independent, open-source and can be ported easily to other Arduino compatible boards. In comparison, a typical approach requires proprietary hardware, is not easy to port to another system and is closed-source.
In times of short product life cycles, additive manufacturing and rapid tooling are important methods to make tool development and manufacturing more efficient. High-performance polymers are the key to mold production for prototypes and small series. However, the high temperatures during vulcanization injection molding cause thermal aging and can impair service life. The extent to which the thermal stress over the entire process chain stresses the material and whether it leads to irreversible material aging is evaluated. To this end, a mold made of PEEK is fabricated using fused filament fabrication and examined for its potential application. The mold is heated to 200 ◦C, filled with rubber, and cured. A differential scanning calorimetry analysis of each process step illustrates the crystallization behavior and first indicates the material resistance. It shows distinct cold crystallization regions at a build chamber temperature of 90 ◦C. At an ambient temperature above Tg, crystallization of 30% is achieved, and cold crystallization no longer occurs. Additional tensile tests show a decrease in tensile strength after ten days of thermal aging. The steady decrease in recrystallization temperature indicates degradation of the additives. However, the tensile tests reveal steady embrittlement of the material due to increasing crosslinking.