Fachbereich Maschinenbau und Mechatronik
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- Conference Proceeding (207) (remove)
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- Gamification (3)
- Additive manufacturing (2)
- Digital Twin (2)
- IO-Link (2)
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Rare event simulation to optimise maintenance intervals of safety critical redundant subsystems
(2018)
Entwicklung einer Qualitätssicherung für das Laserstrahlschweißen im Vakuum mittels Bildverarbeitung
(2019)
Laser-based Additive Manufacturing (AM) processes for the use of metals out of the powder bed have been investigated profusely and are prevalent in industry. Although there is a broad field of application, Laser Powder Bed Fusion (LPBF), also known as Selective Laser Melting (SLM) of glass is not fully developed yet. The material properties of glass are significantly different from the investigated metallic material for LPBF so far. As such, the process cannot be transferred, and the parameter limits and the process sequence must be redefined for glass. Starting with the characterization of glass powders, a parameter field is initially confined to investigate the process parameter of different glass powder using LPBFprocess. A feasibility study is carried out to process borosilicate glass powder. The effects of process parameters on the dimensional accuracy of fabricated parts out of borosilicate and hints for the post-processing are analysed and presented in this paper.
The implementation of IO-Link in the automation industry has increased over the years. Its main advantage is it offers a digital point-to-point plugand-play interface for any type of device or application. This simplifies the communication between devices and increases productivity with its different features like self-parametrization and maintenance. However, its complete potential is not always used.
The aim of this paper is to create an Arduino based framework for the development of generic IO-Link devices and increase its implementation for rapid prototyping. By generating the IO device description file (IODD) from a graphical user interface, and further customizable options for the device application, the end-user can intuitively develop generic IO-Link devices. The peculiarity of this framework relies on its simplicity and abstraction which allows to implement any sensor functionality and virtually connect any type of device to an IO-Link master. This work consists of the general overview of the framework, the technical background of its development and a proof of concept which demonstrates the workflow for its implementation.