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Entwicklung einer Qualitätssicherung für das Laserstrahlschweißen im Vakuum mittels Bildverarbeitung
(2019)
Tribological performance of biodegradable lubricants under different surface roughness of tools
(2019)
Laser-based Additive Manufacturing (AM) processes for the use of metals out of the powder bed have been investigated profusely and are prevalent in industry. Although there is a broad field of application, Laser Powder Bed Fusion (LPBF), also known as Selective Laser Melting (SLM) of glass is not fully developed yet. The material properties of glass are significantly different from the investigated metallic material for LPBF so far. As such, the process cannot be transferred, and the parameter limits and the process sequence must be redefined for glass. Starting with the characterization of glass powders, a parameter field is initially confined to investigate the process parameter of different glass powder using LPBFprocess. A feasibility study is carried out to process borosilicate glass powder. The effects of process parameters on the dimensional accuracy of fabricated parts out of borosilicate and hints for the post-processing are analysed and presented in this paper.
The manufacturing share of laser powder bed fusion (L-PBF) increases in industrial application, but still many process steps are manually operated. Additionally, it is not possible to achieve tight dimensional tolerances or low surfaces roughness. Hence, a process chain has to be set up to combine additive manufacturing (AM) with further machining technologies. To achieve a continuous workpiece flow as basis for further industrialization of L-PBF, the paper presents a novel substrate system and its application on L-PBF machines and post-processing. The substrate system consists of a zero-point clamping system and a matrix-like interface of contact pins to be substantially connected to the workpiece within the L-PBF process.
Additive manufacturing (AM) works by creating objects layer by layer in a manner similar to a 2D printer with the “printed” layers stacked on top of each other. The layer-wise manufacturing nature of AM enables fabrication of freeform geometries which cannot be fabricated using conventional manufacturing methods as a one part. Depending on how each layer is created and bonded to the adjacent layers, different AM methods have been developed. In this chapter, the basic terms, common materials, and different methods of AM are described, and their potential applications are discussed.
Trotz fortschreitender Automatisierung bleiben manuelle Tätigkeiten ein wichtiger Baustein der Fertigung kundenindividueller Produkte. Um die Mitarbeiter(innen) zu unterstützen und um eine effiziente Arbeit zu ermöglichen, werden zunehmend auf Augmented Reality (AR) basierende Systeme eingesetzt. Die vorgestellte Arbeit konzentriert sich auf die Entwicklung ganzheitlicher AR-Arbeitsplätze für den Einsatz in kleinen und mittleren Unternehmen (KMU). Das entwickelte AR- Handarbeitskonzept beinhaltet eine Just-in-time-Darstellung der Arbeitsaufgaben auf Werkstücken mit automatisierter Fertigungskontrolle. Als
Reaktion auf kurze Produktlebenszyklen und hohe Produktvielfalten sind alle Komponenten auf maximale Flexibilität ausgelegt. Ein Umrüsten auf neue Produkte kann innerhalb von Minuten erfolgen.
The implementation of IO-Link in the automation industry has increased over the years. Its main advantage is it offers a digital point-to-point plugand-play interface for any type of device or application. This simplifies the communication between devices and increases productivity with its different features like self-parametrization and maintenance. However, its complete potential is not always used.
The aim of this paper is to create an Arduino based framework for the development of generic IO-Link devices and increase its implementation for rapid prototyping. By generating the IO device description file (IODD) from a graphical user interface, and further customizable options for the device application, the end-user can intuitively develop generic IO-Link devices. The peculiarity of this framework relies on its simplicity and abstraction which allows to implement any sensor functionality and virtually connect any type of device to an IO-Link master. This work consists of the general overview of the framework, the technical background of its development and a proof of concept which demonstrates the workflow for its implementation.