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Table of contents 1. Introduction 2. Multi-level Technology Transfer Infrastructure 2.1 Level 1: University Education – Encourage the Idea of becoming an Entrepreneur 2.2 Level 2: Post Graduate Education – Improve your skills and focus it on a product family. 2.3 Level 3: Birth of a Company – Focus your skills on a product and a market segment. 2.4 Level 4: Ready to stand alone – Set up your own business 2.5 Level 5: Grow to be Strong – Develop your business 2.6 Level 6: Competitive and independent – Stay innovative. 3. Samples 3.1 Sample 1: Laser Processing and Consulting Centre, LBBZ 3.2 Sample 2: Prototyping Centre, CP 4. Funding - Waste money or even lost Money? 5. Conclusion
In: Technical feasibility and reliability of passive safety systems for nuclear power plants. Proceedings of an Advisory Group Meeting held in Jülich, 21-24 November 1994. - Vienna , 1996. - Seite: 43 - 55 IAEA-TECDOC-920 Abstract: It is shown that the difficulty for probabilistic fracture mechanics (PFM) is the general problem of the high reliability of a small population. There is no way around the problem as yet. Therefore what PFM can contribute to the reliability of steel pressure boundaries is demonstrated with the example of a typical reactor pressure vessel and critically discussed. Although no method is distinguishable that could give exact failure probabilities, PFM has several additional chances. Upper limits for failure probability may be obtained together with trends for design and operating conditions. Further, PFM can identify the most sensitive parameters, improved control of which would increase reliability. Thus PFM should play a vital role in the analysis of steel pressure boundaries despite all shortcomings.
Functional testing and characterisation of ISFETs on wafer level by means of a micro-droplet cell
(2006)
A wafer-level functionality testing and characterisation system for ISFETs (ionsensitive field-effect transistor) is realised by means of integration of a specifically designed capillary electrochemical micro-droplet cell into a commercial wafer prober-station. The developed system allows the identification and selection of “good” ISFETs at the earliest stage and to avoid expensive bonding, encapsulation and packaging processes for nonfunctioning ISFETs and thus, to decrease costs, which are wasted for bad dies. The developed system is also feasible for wafer-level characterisation of ISFETs in terms of sensitivity, hysteresis and response time. Additionally, the system might be also utilised for wafer-level testing of further electrochemical sensors.