Fachbereich Maschinenbau und Mechatronik
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Analysis of error and time behavior of the IEEE 802.15.4 PHY-layer in an industrial environment
(2006)
Praktische Untersuchungen zum zeitlichen Übertragungs- und Bündelfehlerverhalten der IEEE 802.15.4
(2006)
In the Laser Powder Bed Fusion (LPBF) process, parts are built out of metal powder material by exposure of a laser beam. During handling operations of the powder material, several influencing factors can affect the properties of the powder material and therefore directly influence the processability during manufacturing. Contamination by moisture due to handling operations is one of the most critical aspects of powder quality. In order to investigate the influences of powder humidity on LPBF processing, four materials (AlSi10Mg, Ti6Al4V, 316L and IN718) are chosen for this study. The powder material is artificially humidified, subsequently characterized, manufactured into cubic samples in a miniaturized process chamber and analyzed for their relative density. The results indicate that the processability and reproducibility of parts made of AlSi10Mg and Ti6Al4V are susceptible to humidity, while IN718 and 316L are barely influenced.
Entwicklung einer Qualitätssicherung für das Laserstrahlschweißen im Vakuum mittels Bildverarbeitung
(2019)
Neue Perspektiven für die Bahn in der Produktions- und Distributionslogistik durch Prozessautomation
(2020)
The manufacturing share of laser powder bed fusion (L-PBF) increases in industrial application, but still many process steps are manually operated. Additionally, it is not possible to achieve tight dimensional tolerances or low surfaces roughness. Hence, a process chain has to be set up to combine additive manufacturing (AM) with further machining technologies. To achieve a continuous workpiece flow as basis for further industrialization of L-PBF, the paper presents a novel substrate system and its application on L-PBF machines and post-processing. The substrate system consists of a zero-point clamping system and a matrix-like interface of contact pins to be substantially connected to the workpiece within the L-PBF process.
Der Embedded Wireless-Report
(2014)
Feldbustechnologie
(2014)
Bussysteme
(2006)
Alles automatisch : komplexes qualitätsorientiertes Logistikmanagement durch Vollautomatisierung
(1998)
Die Kunst des Weglassens : Windows NT Embedded - Was die neue Version vom Standard-NT unterscheidet
(1999)
Harte Echtzeit für Windows
(1999)
10 Regeln für das Desaster
(2001)
UWB, ZigBee und Z-Wave in der Automatisierung : neue Konkurrenzsituation bei Short Range Wireless?
(2007)
Objekt-orientierte Modellierung hybrider Systeme mit heuristischen und analytischen Merkmalen
(1994)